Parete

	COB(Frip Chip)	GOB	SMD
Basic structure	The LED chip is mounted upside down on the PCB without copper wires, resulting in a simple structure with improved convection.	The surface of an SMD panel product is covered with resin.	LED components soldered to the circuit board
Contrast ratio*1	Highest	Normal	Low
Image quality*2	Excellent	Normal	Normal
Viewing angle*3	Widest	Normal	Normal
Brightness*4	Highest	Normal	Normal
Energy efficiency*5	Highest	Normal	Normal
Durability*6	◎	◎	△
Heat dissipation*7	Best	Normal	Good
Failure rate*8	<5ppm	<25ppm	<50ppm
Applicable pixel pitch	≤ 0.4mm	≤ 1.2mm	≤ 1.2mm
Impact resistance	◎	◎	×
Moisture resistance	◎	◎	×
Cost	High	Normal	Low

*1: Compared to other flip-chip displays, COB flip-chips have a smaller pad bonding area, creating more space between chips and improving contrast.
*2: Due to the smaller chip size of COB flip-chips, pixel pitches can reach 0.4 to 1.2 mm, enabling finer image quality.
*3: Due to their different basic structure, COB (flip-chip) displays have a relatively wide viewing angle.
*4: Due to their smaller bonding area, COB displays can use larger chips than SMD displays, achieving higher brightness.
*5: COB displays have the voltage required for RGB, while the flip-chip structure reduces current consumption, making them more energy-efficient.
*6: Due to their simple structure, there are fewer process steps leading to defects, resulting in a longer lifespan.
*7: The flip-chip structure has excellent thermal conductivity and low heat generation, dissipating heat directly to the front and back of the PCB, providing excellent heat dissipation.
*8: Due to their different basic structure, COB (flip-chip) displays have fewer production steps and a lower failure rate.